Printed circuit board suction device
The substrate is adsorbed and transported without changing the setup, depending on the size of the substrate and the position of the holes.
There is no need to change the setup of the suction device based on the size of the substrate or the position of the holes. The substrate is held in a non-contact state by a negative pressure generation function that blows air, allowing for transport. Therefore, it does not leave scratches or dirt on the substrate.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
